{"id":21,"count":4,"description":"Different package types put different demands on carrier tape: fine-pitch ICs need tight pocket tolerance, LEDs need optical clarity and heat resistance, and semiconductor shipments often require low-outgassing materials. This section groups our guides and equipment recommendations by end application so you can start from the component rather than the machine. Each application page explains the tape material, typical pocket geometry and the forming or punching setup that suits it, along with the defects that appear when the wrong combination is specified.","link":"https:\/\/jinyingteng.com\/vi\/applications\/","name":"\u1ee8ng d\u1ee5ng","slug":"applications","taxonomy":"category","parent":0,"meta":[],"_links":{"self":[{"href":"https:\/\/jinyingteng.com\/vi\/wp-json\/wp\/v2\/categories\/21","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jinyingteng.com\/vi\/wp-json\/wp\/v2\/categories"}],"about":[{"href":"https:\/\/jinyingteng.com\/vi\/wp-json\/wp\/v2\/taxonomies\/category"}],"wp:post_type":[{"href":"https:\/\/jinyingteng.com\/vi\/wp-json\/wp\/v2\/posts?categories=21"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}